| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive sheet which acts as a dicing tape in a dicing step and exhibits excellent bonding reliability in the step of bonding a semiconductor element to a supporting member. <P>SOLUTION: The adhesive sheet is prepared by laminating (1) a radiation-polymerizable pressure-sensitive adhesive layer containing an epoxy resin and an epoxy resin curing agent, a high-molecular-weight component having a weight-average molecular weight of 100,000 or higher, and a radiation-polymerizable compound obtained by reacting (a) a diol with (b) an isocyanate represented by formula (I) and (c) a compound represented by formula (II), (2) an epoxy resin and an epoxy resin curing agent, and (3) a support film in the given order. In formulae (I) and (II), n is an integer of 0 or 1; R<SP>1</SP>is a 1-30C divalent or valent organic group; R<SP>2</SP>is hydrogen or a methyl group; and R<SP>3</SP>is an ethylene group or a propylene group. <P>COPYRIGHT: (C)2004,JPO</p> |
