发明名称 |
CONDUCTIVE PATH OR ELECTRODE, AND METHOD FOR FORMING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a method for simply forming a conductive path or an electrode with high manufacturing efficiency with high resolution and positional accuracy. SOLUTION: The method for forming the conductive path or the electrode includes steps of ablating a metal fin particle containing layer containing metal fine particles each having a mean particle size of 50 nm or less and in a state that fine particles are isolated by an organic material on a support, patterning the metal fine particle containing layer in a target shape, and then heating to heat and fusion-bond the metal fine particles. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004039791(A) |
申请公布日期 |
2004.02.05 |
申请号 |
JP20020193266 |
申请日期 |
2002.07.02 |
申请人 |
KONICA MINOLTA HOLDINGS INC |
发明人 |
HIRAI KATSURA;KITAMURA SHIGEHIRO |
分类号 |
H01L21/288;H01L21/336;H01L29/786;(IPC1-7):H01L21/288 |
主分类号 |
H01L21/288 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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