发明名称 |
FLIP-CHIP BALL GRID ARRAY PACKAGE FOR ELECTROMIGRATION TESTING |
摘要 |
A test package for electromigration testing includes a die having a plurality of I/O pads formed on a metal layer, a plurality of traces formed on the die electrically connecting adjacent pairs of the I/O pads, a plurality of bumped interconnects formed on the I/O pads, and a substrate having a plurality of bump-to-bump interconnects formed on a top surface of the substrate adjacent to the die wherein the plurality of bump-to-bump interconnects is electrically coupled to the plurality of bumped interconnects so that the plurality of bumped interconnects is connected in series.
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申请公布号 |
US2004021232(A1) |
申请公布日期 |
2004.02.05 |
申请号 |
US20020212448 |
申请日期 |
2002.08.05 |
申请人 |
PEKIN SENOL;GOVIND ANAND;IWASHITA CARL |
发明人 |
PEKIN SENOL;GOVIND ANAND;IWASHITA CARL |
分类号 |
H01L23/498;H01L23/544;H05K1/02;H05K1/11;(IPC1-7):H01L23/48 |
主分类号 |
H01L23/498 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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