| 发明名称 |
Overmolded device with contoured surface |
| 摘要 |
An electronic device has three dimensional surface features molded into an encapsulant forming an electronic package. The electronic package has improved heat transfer compared to conventional electronic devices. The three dimensional features are designed to be moldable.
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| 申请公布号 |
US2004022031(A1) |
申请公布日期 |
2004.02.05 |
| 申请号 |
US20030438721 |
申请日期 |
2003.05.15 |
| 申请人 |
BEL FUSE, INC. |
发明人 |
MILES MARSHALL;HUA GARY |
| 分类号 |
H01L23/31;H01L23/367;H01L25/16;H05K5/00;(IPC1-7):H05K7/20 |
主分类号 |
H01L23/31 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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