| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a dressing method, a dressing apparatus, and a polishing apparatus for a polishing tool, by which unevenness having an appropriate magnitude is easily formed on the surface of the polishing tool for chemical-mechanical polishing (CMP), and the life of the dressing apparatus is lengthened. <P>SOLUTION: The unevenness is formed by dressing the surface of the fixed grain polishing tool 10 of the polishing apparatus by means of the dressing apparatus 20. The dressing apparatus 20 is composed of a laser machining means for forming the unevenness by irradiating the surface of the fixed grain polishing tool 10 with a laser beam L. Besides the laser machining means, the dressing apparatus 20 may be composed of a blasting means for forming the unevenness by spraying minute particles on the surface of the fixed grain polishing tool or a stamping means for transferring the uneven shape provided on the surface of the stamp to the surface of the fixed grain polishing tool 10 by pushing the uneven shape provided on the surface of the stamp against the the surface of the fixed grain polishing tool 10. <P>COPYRIGHT: (C)2004,JPO |
