| 摘要 |
PROBLEM TO BE SOLVED: To provide a pressure-sensitive adhesive sheet for semiconductor processing which prevents the buildup of static electricity during the processing and thereby prevents a semiconductor device and a product from being broken or deteriorated by the charge of static electricity. SOLUTION: The film support made from a mixture comprising 25-75 pts. wt. polypropylene, 75-25 pts. wt. block copolymer composed of (A) polystyrene block represented by formula (1) and (B) vinylpolyisopropylene blocks represented by formula (2), and 1-30 pts. wt. polymeric antistatic agent based on a polyether. The pressure-sensitive adhesive sheet has a pressure-sensitive adhesive layer comprising a base polymer, a radiation-polymerizable compound, and a radiation polymerization initiator. COPYRIGHT: (C)2004,JPO |
