| 摘要 |
PURPOSE:To enable excellent line bonding, by plating the gold of high purity less than 0.4 mum and cleaning the surface via the metal plating layer through which copper can not be penetrated, on the copper foil on the resin base surface. CONSTITUTION:The line bonding is sufficient with the surface hardness of the resin base such as paper epoxy and paper phenol. Further, it is discovered that the purity of gold plated and the surface dirtness can give greater effect on the characteristics of the line bonding more than the requirements of the thickness of sinking due to rubbing of the metal fine wires. Accordingly, by managing these two factors, the line bonding excellent to the gold layer 0.4 mum or less which can be regarded as impossible, can be made. That is, the metal which dose not penetrate copper is plated on the copper foil, gold plating having greater purity 0.4 mum or less in thickness is made with sufficient cleaning, can solve the problems. |
