| 摘要 |
PROBLEM TO BE SOLVED: To provide line-solder having a low melting point which has excellent wettability, and can correct the soldered section of a low heat resistant part, and to provide a process of producing electronic equipment using the same. SOLUTION: The line-solder comprises Bi, and has a solder part consisting of a lead-free solder material and a flux part formed on the surface of the solder part. The process has a stage wherein an electronic part is mounted on a substrate by using lead-free solder; a stage wherein the substrate mounted with the semiconductor device is inspected; and a stage wherein, when the defect in the connection of the solder is confirmed in the inspection stage, the defected part in the connection of the solder is corrected. In the correction stage, the defected part in the connection of the solder is corrected by using the line-solder comprising Bi, and having a solder part consisting of a lead-free solder material and a flux part formed on the surface of the solder part. COPYRIGHT: (C)2004,JPO
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