| 摘要 |
PROBLEM TO BE SOLVED: To solve the problem that it is impossible to radiate heat generated when a semiconductor element is operated to the atmosphere. SOLUTION: This package for housing a semiconductor element is configured of an insulating substrate 1 having a recess 1a on whose upper face a semiconductor element 3 is mounted and housed and a wiring conductor 6 led out from the recess 1a to the outer surface and a cover body 2 wherein the semiconductor element 3 is hermetically housed in the recess 1a of the insulating substrate 1. The insulating substrate 1 is provided with a plurality of through metal layers penetrating the buttom face to the lower face of the recess 1a, and the cross-sectional area of the penetrating metal side layer 8 is gradually made wider from the bottom face of the recess 1a toward the lower face of the insulating substrate 1, and the bottom face of the recessed part 1a is coated with a mesh-shaped heat transfer layer 9 linking the exposed edges of the through-metal layer 6, and a part of the outer periphery of the heat transfer layer 9 is formed of a projection 9a or a notch 9b. COPYRIGHT: (C)2004,JPO |
