发明名称 HIGH-FREQUENCY WIRING BOARD
摘要 PROBLEM TO BE SOLVED: To provide a wiring board containing an unnecessary high-frequency absorbing function that can prevent the leakage of unnecessary high-frequency signals from a power supply line even when the function does not use any expensive single-plate capacitor element. SOLUTION: In this high-frequency wiring board, a high-frequency component mounting section, a transmission circuit for high frequency connected to the high-frequency terminal of a high-frequency component 7, and a power source circuit connected to the power supply terminal of the component 7, are formed on the surface of a dielectric substrate 4. Since a power supply line 11e or via hole conductor 20 in the power source circuit is formed of a highly magnetically permeable low-resistant material containing at least one kind of metal selected from among Fe, Co, and Ni having relative permeability of≥80 and electric resistivity of≤1.0 (μΩm), this wiring board can absorb the unnecessary high-frequency signals. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004039739(A) 申请公布日期 2004.02.05
申请号 JP20020192235 申请日期 2002.07.01
申请人 KYOCERA CORP 发明人 KORIYAMA SHINICHI
分类号 H01L23/12;H01P1/00;(IPC1-7):H01L23/12 主分类号 H01L23/12
代理机构 代理人
主权项
地址