| 摘要 |
PROBLEM TO BE SOLVED: To provide a three dimensional wiring structure where there can be electrically easily connected portions which are desired to be made electrically conductive, and when electrical conduction is interrupted owing to circumstances, there is lost electrical conduction at a portion where electrical conduction is desired to be obstructed, and hereby electrical conduction/insulation can be changed with ease. SOLUTION: In the three dimensional wiring structure wherein opposing wiring pattern-shaped metal wiring circuits are provided via a semi-insulating substance which is conductive when higher voltage than operation voltage is applied, voltage is applied between specific metal wiring circuits to permit metal to be deposited on the one metal wiring circuit, whereby a wiring for connecting between the foregoing metal wiring circuits is formed in the foregoing semi-insulating substance. COPYRIGHT: (C)2004,JPO
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