发明名称 METHOD FOR DIVIDING CERAMICS CHIP CAPACITOR SHEET
摘要 PROBLEM TO BE SOLVED: To provide a method for dividing a ceramics chip capacitor sheet by which an alignment mark can be surely detected when a V-groove is formed in an alignment mark area of the ceramics chip capacitor sheet and the appeared alignment mark is picked up. SOLUTION: The method is used to divide into chip capacitors a ceramics chip capacitor sheet that is formed by alternately laminating a ceramics layer, and an electrode layer that is provided with an electrode area having a plurality of electrodes formed on the surface of the ceramics layer and an alignment mark area surrounding the electrode area and having an alignment mark indicating the position of the electrode. When a V-groove is formed in the alignment mark area and the appeared alignment mark is picked up, an imaging means and the ceramics chip capacitor sheet are relatively moved in a cutting feed direction, so that the alignment mark may be positioned at a specified position in an image pick-up range by the imaging means. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004039906(A) 申请公布日期 2004.02.05
申请号 JP20020195793 申请日期 2002.07.04
申请人 DISCO ABRASIVE SYST LTD 发明人 SAITO TAKAHIRO
分类号 H01G4/30;(IPC1-7):H01G4/30 主分类号 H01G4/30
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