| 摘要 |
PROBLEM TO BE SOLVED: To provide the production of a wiring circuit substrate which forms a conductor layer of a uniform thickness in spite of the configuration or arrangement of a wiring circuit pattern. SOLUTION: A conductive thin film 2 is formed on a base insulation layer 1, and a plated resist 3 is formed on the conductive thin film 2 with the reverse pattern of a predetermined wiring circuit pattern. Thereafter, a conductive layer 4 is formed by electrolysis plating on a part in the conductive thin film 2, whereat the plated resist 3 is not formed as a predetermined wiring circuit pattern. Then, the conductive layer 4 is etched to the halfway in the direction of the thickness thereof under a condition that the plated resist 3 is formed. The conductive thin film 2 at the part of the plated resist 3 and a part opposed to the plated resist 3 is removed, and a cover insulation layer 5 is applied on the conductive layer 4 to obtain the wiring circuit substrate. According to this method, the thickness of the conductive layer 4 can be uniformed by the etching even when varieties are generated in the thickness of the conductive layer 4 immediately after the layer is formed by the electrolysis plating. COPYRIGHT: (C)2004,JPO
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