MODULE WITH BUILT-IN CIRCUIT COMPONENT AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To provide a highly reliable module with built-in circuit component that can prevent functions of circuit components embedded in an electrical insulating substrate from being damaged when the module is mounted on a mother substrate by soldering.

SOLUTION: Inner via holes 6 are formed in the electrical insulating substrate 2 so as to electrically connect the substrate 2, a plurality of wiring patterns 3 formed on at least the main surface of the substrate 2, the circuit components 4 arranged in the substrate 2 and electrically and mechanically connected to the wiring patterns 3 by soldering 7, cases 5 having spaces in the substrate 2 so as to cover the components 4, and a plurality of wiring patterns to each other.

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