发明名称 |
CONNECTION STRUCTURE BETWEEN SOLID INSULATORS FOR COVERING HIGH VOLTAGE CONDUCTOR |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To upgrade a dielectric strength and reduce an occupied space of a power equipment and apparatus. <P>SOLUTION: An interface 7 between a first solid insulator 5 and a second solid insulator 6 which comes into contact with each other is formed in such a manner as to have a slope surface 8 with an angle of greater than 0°and less than 90°with respect to an axial direction of a first high voltage conductor 3 and a second high voltage conductor 4, and at least one folding-back portion 9 for folding back the slope surface 8 in a direction opposite to the axial direction of the first high voltage conductor 3 and the second high voltage conductor 4. <P>COPYRIGHT: (C)2004,JPO</p> |
申请公布号 |
JP2004040989(A) |
申请公布日期 |
2004.02.05 |
申请号 |
JP20020198864 |
申请日期 |
2002.07.08 |
申请人 |
CENTRAL RES INST OF ELECTRIC POWER IND |
发明人 |
TAKAHASHI TOSHIHIRO;TAKAHASHI TSUGUHIRO;TAKEDA TOSHIHISA;OKAMOTO TATSUKI |
分类号 |
H02B1/20;H02G1/14;H02G15/08;(IPC1-7):H02G15/08 |
主分类号 |
H02B1/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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