| 摘要 |
PROBLEM TO BE SOLVED: To manufacture a chip sow using an ultrahigh pressure sintered chip like PCD, for example, a hollow face-type chip sow at a practical cost, and to provide the same. SOLUTION: The chip sow is constructed by bonding chips 12 to the tops of a number of tooth bodies 14 respectively. The chips 12 comprise a ultrahigh pressure sintered body where polycrystal sintered layers 22 are laminated on the surface of a hard metal-base material 20. These two chips 12, 12 are superimposed in a direction where the sintered layers 22 are almost aligned and bonded by spot-welding at the base materials 20 sections. COPYRIGHT: (C)2004,JPO
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