| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device which can reduce a failure in a solder-connecting portion in a secondary mounting and a failure in a solder-connecting portion in a reliability test after the secondary mounting. SOLUTION: A wiring board 30 comprises an insulated basic material 40 on which conductive members 50 are formed. The insulated basic material 40 is formed with a through-hole 53 penetrating a second main surface 42 from a first main surface 41. The conductive member 50 comprises a pad 51 for chip connection provided on the first main surface 41, a wiring portion 52 provided on the internal wall surface of the through-hole 43, and a re-arrangement pad 53 which closes the through-hole 43 and exposed in the same surface as the second main surface 42. The pad 51 for chip connection, wiring portion 52 and re-arrangement pad 53 are formed of continuous members. COPYRIGHT: (C)2004,JPO
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