发明名称 Static charge dissipation for an active circuit surface
摘要 A structure and method is disclosed for dissipating electrostatic charges comprising an insulating layer between and over a plurality of conductive plates, wherein the insulating layer isolates the conductive plates and protects the conductive plates from damage, and wherein the insulating layer comprises a conductive discharge grid adjacent the conductive plates.
申请公布号 US6686546(B2) 申请公布日期 2004.02.03
申请号 US19980224812 申请日期 1998.12.30
申请人 STMICROELECTRONICS, INC. 发明人 CHIU ANTHONY M.
分类号 G01B7/28;A61B5/117;G06K9/00;(IPC1-7):G09G5/00 主分类号 G01B7/28
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