SEMICONDUCTOR DEVICE INCLUDING TEST ELEMENT GROUP

摘要

PURPOSE: A semiconductor device including a test element group is provided to increase the number of chips formed on a wafer and enhance the productivity by reducing the width of a scribe region between main chips. CONSTITUTION: A semiconductor device including a test element group includes a plurality of chip regions(22), a scribe region(24), a plurality of main pads(28), a plurality of test element groups(30), and a plurality of wires(34). The chip regions(22) are formed on a semiconductor substrate. The scribe region(24) is used for dividing the chip regions. The main pads(28) are formed within the chip regions. The test element groups(30) are formed within the scribe region. The wires(34) are used for connecting the test element groups to the main pads.