| 摘要 |
PURPOSE: A cover assembly structure is provided to achieve improved productivity by permitting the cover to be assembled onto the PCB in a convenient manner, while protecting chip components mounted on the PCB from thermal damages. CONSTITUTION: An RF module comprises a PCB(10) on which a plurality of chip components are mounted; and a cover(20) disposed on the PCB in such a manner that the electromagnetic wave generated from the chip components from being radiated to the outside. The PCB has grooves(14,18) corresponding to leads(24,28) formed front, rear, left and right rims of the cover. A mounting portion(4) is formed at each of the grooves of the PCB in such a manner that a certain part of the end of the lead gets caught at the mounting portion.
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