HIGHLY THERMAL CONDUCTIVE GREASE, ITS PREPARATION PROCESS, AND METHOD OF USING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a highly thermal conductive grease, which is to be placed between a heat generating component and a heat sink to effectively carry out heat emitting and absorbing processes, wherein the thermal conductivity is much higher than that of a conventional silicone grease, and also to provide its preparation process and the method of using the same. SOLUTION: The grease is prepared by incorporating a marketed silicone grease with ultrafine particles having the thermal conductivity at least higher than that of a copper material. The grease is placed, for example, between the electronic component 2 such as transistor and the heat sink 4 to promote effective heat emission of an electronic component 2. COPYRIGHT: (C)2004,JPO