| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor chip including a re-wiring layer as an integral part thereof, which has a high operation stability, allows a high degree of freedom in designing a mounting substrate, and has a high speed operation with low power consumption. SOLUTION: The semiconductor chip 1A comprises an IC 1 wherein a plurality of circuit blocks 51-55 are formed on a circuit formation surface and many input/output terminals 2a-2d are arranged in the periphery of the circuit blocks 51-55; a first insulation layer 9 formed on the circuit formation surface of the IC 1; the re-wiring layer 3 which is formed on the first insulation layer 9 and which includes interconnection lines 3a-3d for setting bumps, with one end being connected to the input/output terminals 2a-2d, and a shielding portion 3e; bumps 6 formed on the interconnection lines 3a-3d for setting bumps; and a second insulation layer 11 which covers the re-wiring layer 3. Surfaces of a power circuit 51 and a comparison amplifier circuit 53 are covered by the shielding section 3e, which is connected to the power supply terminal 2a. COPYRIGHT: (C)2004,JPO
|
