| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-coated adhesive sheet made proof against unnecessary adhesion to something other than an adherend in a semiconductor production step, which improves sticking and workability after sticking of the adherend, and is not problematic in the emission of an odor during curing the pressure-sensitive adhesive layer by light irradiation, and to provide a double-coated adhesive sheet which fixes a thing, such as a thin-film wafer or a ceramic, to be diced so as to allow its efficient processing at high precision. SOLUTION: The double-coated adhesive sheet is prepared by forming adhesive layers on both surfaces of a base film, wherein each adhesive layer is prepared by crosslinking at least one silicone selected from a silicone comprising a linear polyorganosiloxane having vinyl groups only at both terminals and a silicone comprising a linear polyorganosiloxane having vinyl groups at both terminals and side chains. COPYRIGHT: (C)2004,JPO |
