发明名称 |
METHOD FOR MOUNTING OF COMPONENT TO BE MOUNTED |
摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method capable of simplifying a mounting structure and simplifying a mounting process without using a stop-catch (an exclusive clamp) as another component when a component to be mounted such as a wire harness is mounted onto a panel and the like. <P>SOLUTION: This mounting method comprises fixing a specific component to be mounted such as the wire harness to an objective material such as a panel. An injection molding machine and a mold are used. A cavity for molding a mounting component of a size larger than a width of the component to be mounted is formed inside the mold. An opening of the cavity is closed by abutting a separating surface of the mold onto an objective (a mounted surface) while the component to be mounted made along the objective material is likely to be covered. Molten resin is injected into the cavity under this state and solidified by cooling. The mounting component is integrally formed with the objective material and the component to be mounted thereby to fix the mounting component to the objective material. <P>COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004025503(A) |
申请公布日期 |
2004.01.29 |
申请号 |
JP20020182053 |
申请日期 |
2002.06.21 |
申请人 |
DAIWA KASEI IND CO LTD |
发明人 |
HARA NAOYASU;NAGAI HIROMITSU |
分类号 |
B29C45/14;B29C65/70;H02G3/30;H02G3/38 |
主分类号 |
B29C45/14 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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