| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and an apparatus for supplying solder in small quantities on a substrate. SOLUTION: In order that solder is fused in a mixing chamber 6 and then transported to a substrate 1 with a gas flow, a soldering wire 7 and a forming gas to be heated to a prescribed temperature are supplied to the mixing chamber of a nozzle 4 with a double structured part and then onto the substrate. In addition, with the purpose of distributing the solder to the prescribed part of the substrate, the nozzle with the double structured part is moved or rotated relative to the substrate. COPYRIGHT: (C)2004,JPO
|
