| 摘要 |
PROBLEM TO BE SOLVED: To materialize a stable conveyance without causing a warping of a wafer at the time of conveying the wafer, and to promptly cope with a case that a change of a wafer size to be processed is demanded. SOLUTION: The wafer as a substrate to be processed is placed on a conveying tray equipped with an electrostatic attractive mechanism to be conveyed, whereby the problems of the warping of the wafer and a damage accompanied by the warping were solved to stably convey and process the substrate. Further, a system in which the respective conveying trays for a 200mm wafer and a 300mm wafer are provided with interchangeability for a side of a substrate processing device, and the tray is automatically selected according to the wafer size by a controller is constructed, thereby enhancing productivity. COPYRIGHT: (C)2004,JPO |
