| 摘要 |
PROBLEM TO BE SOLVED: To provide an epoxy resin composition for sealing an optical semiconductor which ensures a stable reliability in moisture resistance reliability tests such as PCT and THB, even when sealing an optical semiconductor element having Al lines as metal lines. SOLUTION: The epoxy resin composition essentially comprises (A) an epoxy resin, (B) a hardener and (C) a hardening accelerator. A molded product of the composition yields a water extract having a pH of 3.8-4.5, an electric conductivity of <10 mS/m and a Cl<SP>-</SP>ion concentration of <10 ppm. When sealing the optical semiconductor element having the metal wiring such as the Al wiring, the composition requires no compounding of a filler, retains a high optical transparency and drastically improves the moisture resistance reliability. COPYRIGHT: (C)2004,JPO
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