| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a mounting method and a mounting apparatus, which are capable of easily and accurately reading an aligning recognition mark in a short time, and shortening a mounting tack markedly, without evacuating objects to be on bonded or without moving the recognition means if circumstances require, even when an adhesive layer is interposed between the objects to be bonded. <P>SOLUTION: The mounting method and the mounting apparatus are so set as to recognize the alignment recognition mark attached to a first object to be bonded by a recognition means, through the intermediary of infrared rays penetrating through the first object to be bonded, the adhesive layer, and the second object to be bonded, since the adhesive layer is interposed between the objects to be bonded. <P>COPYRIGHT: (C)2004,JPO |
