| 摘要 |
PROBLEM TO BE SOLVED: To prevent the deterioration of strength at the time of carrying out hot-pressing due to the non-uniformity of distances or array between via holes, and to prevent pressure centralization to a wiring pattern non-formation area. SOLUTION: This multi-layer printed wiring board is configured of a plurality of laminated circuit boards equipped with via holes formed by packing through-holes arranged in insulating base materials with conductive substances, and formed with conductor circuits including wiring patterns electrically connected to the via holes. At least one layer of the plurality of circuit boards is formed with a dummy pattern in an area where any conductor circuit electrically connected to the via hole is not formed on the surface of the insulating base material. COPYRIGHT: (C)2004,JPO |
