| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method of film lamination, with which the pressure for the lamination within the laminating area is uniformized when the film is pressed to a substrate having a protruding conductor circuit. <P>SOLUTION: In the method of film lamination to a conductor-circuit plane of the substrate having the protruding conductor circuit, a protruding pressure-balancing layer is provided on the exterior of the conductor circuits at a position that corresponds to outer circumference of a pair of pressing boards in laminating the film to the conductor-circuit plane, wherein the substrate and the film are interposed between the pressing boards in such a way that the pressure-balancing layer and at least a part of the outer edges of the pressing boards are overlapped in the perpendicular direction. <P>COPYRIGHT: (C)2004,JPO</p> |
