| 摘要 |
PROBLEM TO BE SOLVED: To provide a method of manufacturing semiconductor chips, with which the occurrence of cracks in manufacturing thin semiconductor chips is easily prevented, leading to improvements in quality and productivity, and to provide a manufacturing apparatus for semiconductor chips. SOLUTION: Cut grooves 2 for dicing formed on the surface of a substrate 1 along scribe lines for the chips are filled with an adhesive by gluing a protective tape 3 on the cut grooves 2. Pelletization is then carried out by backside-grinding the substrate. Successively, the protective tape 3 is peeled off. COPYRIGHT: (C)2004,JPO |
