发明名称 WIRING BOARD AND ELECTRONIC DEVICE USING THE SAME
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a wiring board with the excellent connection reliability of a wiring conductor and a through conductor even when a long-term heat load is repeatedly impressed. <P>SOLUTION: The wiring board is composed by alternately laminating an insulation layer 1 composed by impregnating a heat resistant fiber base material with thermosetting resin and the wiring conductor composed of copper foil for two or more layers and electrically connecting the wiring conductors 2 positioned above and below holding the insulation layer 1 there between with each other by the through conductor 4 composed by filling a through-hole 3 provided on the insulation layer 1 with a conductive material containing the thermosetting resin and metal powder 5 whose average particle diameter is 4-6μm. The wiring conductor 2 is provided with 10 to 30 connection points with the metal powder 5 per 1,000μm<SP>2</SP>on a surface connected with the through conductor 4. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004031814(A) 申请公布日期 2004.01.29
申请号 JP20020188455 申请日期 2002.06.27
申请人 KYOCERA CORP 发明人 NITAO TOMOHIRO
分类号 H05K1/11;H01L23/12;H05K3/46;(IPC1-7):H05K3/46 主分类号 H05K1/11
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