SUBSTRATE FOR MOUNTING HIGH-FREQUENCY CIRCUIT COMPONENT, HIGH-FREQUENCY SEMICONDUCTOR PACKAGE, AND THEIR PACKAGING STRUCTURE

摘要

PROBLEM TO BE SOLVED: To solve a problem that high-frquency signal leaks when the high frequency signal is propagated from a circuit board to a board for mounting a high-frequency circuit component or a high frequency semiconductor package. SOLUTION: A metal terminal thinner than a metal bottom plate in thickness is fixed to the substrate for mounting the high frequency circuit component or the high-frequency semiconductor package to connect a circuit board to the substrate for mounting the high frequency circuit component or the high frequency semiconductor package so that a side end of a penetration conductor of the metal terminal projects ahead of a side end of a penetration conductor of an external drawer line conductor. COPYRIGHT: (C)2004,JPO