| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing a multilayered wiring board with good dimension accuracy by decreasing the deformation of a ceramic green sheet with stably forming a viahole conductor. SOLUTION: The ceramic green sheet 21 with the viahole conductor buried therein is formed via processes 1 -4 mentioned below. (Process 1) A through hole reaching a carrier film 22 is formed on a predetermined position of the ceramic green sheet 21 arranged on the carrier film 22. (Process 2) The carrier film 22 is separated from the ceramic green sheet 21 by bonding a supporting film 23 on the ceramic green sheet 21 so as to block up the through hole. (Process 3) A conductive paste 26 is filled into the through hole of the ceramic green sheet 21 from the opposite side of the supporting film 23 to be dried. (Process 4) The ceramic green sheet 21 with the buried viahole conductor 26 is obtained by separating the supporting film 23 from the ceramic green sheet 21. COPYRIGHT: (C)2004,JPO |
