发明名称 |
Film carrier tape for semiconductor package and manufacturing method thereof |
摘要 |
A film carrier tape and a method of forming a film carrier tape that incorporates a polymeric reinforcement film are provided for decreasing the deformation of and damage to film carrier tapes by forces resulting from contact with sprocket teeth during the semiconductor assembly process. The reinforcement film may include one or more synthetic resins and may increase the useable area of a base film used in forming film carrier tapes. |
申请公布号 |
US2004017001(A1) |
申请公布日期 |
2004.01.29 |
申请号 |
US20030621376 |
申请日期 |
2003.07.18 |
申请人 |
CHUNG YE-CHUNG;LEE SI-HOON |
发明人 |
CHUNG YE-CHUNG;LEE SI-HOON |
分类号 |
H01L21/60;H01L23/495;H05K3/00;(IPC1-7):H01L23/02 |
主分类号 |
H01L21/60 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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