SEMICONDUCTOR PACKAGE EQUIPPED WITH HEAT DISSIPATING PLATE

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor package equipped with a heat dissipating plate which has excellent heat dissipation characteristics and improves reliability. SOLUTION: The semiconductor package is provided with a wafer 11 on which a through hole is opened; a heat dissipating plate 12 which has a first front surface 120 and a second front surface 121 positioned on the rear side thereof, is stuck on the wafer 11 by coating the first front surface 120 with an adhesive 13 containing metal particles and seals one opening of the through hole 113; a chip housed within the through hole 113 on the wafer 11 and adhered on the first front surface 120 of the heat dissipating plate by the adhesive 13; a plurality of first conductive elements 15 for forming an electrical connection relationship between the semiconductor chip 14 and the wafer 11; a plurality of second conductive elements 17 mounted on the same side as the heat dissipating plate 12 side of the wafer 11 to provide electrical characteristics of the wafer 11 to an external device; and a sealing resin layer 16 for coating the semiconductor chip 14 and the first conductive elements 15. COPYRIGHT: (C)2004,JPO