摘要 |
Methods and systems for forming slots in a print head substrate having a thickness defined by opposing first and second surfaces. In one exemplary embodiment, a trench is received in the first surface and extends through less than an entirety of the thickness of the substrate. A plurality of slots extends into the substrate from the second surface and connects with the trench to form a compound slot through the substrate. In this embodiment, the trench is wider at portions proximate to said slots than at portions more distant to said slots.
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