发明名称 |
INTEGRATED COOLING OF A PRINTED CIRCUIT BOARD STRUCTURE |
摘要 |
<p>A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.</p> |
申请公布号 |
EP1384396(A1) |
申请公布日期 |
2004.01.28 |
申请号 |
EP20020766904 |
申请日期 |
2002.04.30 |
申请人 |
INFINEON TECHNOLOGIES AG |
发明人 |
BARTOLA, ROBERT;MOGEL, JAMES;LAUREANTI, STEVEN, J. |
分类号 |
H01L23/473;H05K1/02;(IPC1-7):H05K1/02 |
主分类号 |
H01L23/473 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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