发明名称 INTEGRATED COOLING OF A PRINTED CIRCUIT BOARD STRUCTURE
摘要 <p>A cooling system for electronic components and printed circuit boards (PCBs) provides close thermal contact of a bulk coolant circulating through channels formed inside or on the surface of a multi-layer PCB carrying the electronic components, such that heat produced by the components is efficiently removed to a heat sink. The circulation channels may be formed by removing portions of layers, and inserting overlaying vias, during manufacturing or assembly of the PCB.</p>
申请公布号 EP1384396(A1) 申请公布日期 2004.01.28
申请号 EP20020766904 申请日期 2002.04.30
申请人 INFINEON TECHNOLOGIES AG 发明人 BARTOLA, ROBERT;MOGEL, JAMES;LAUREANTI, STEVEN, J.
分类号 H01L23/473;H05K1/02;(IPC1-7):H05K1/02 主分类号 H01L23/473
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