A dicing tape and a method of dicing a semiconductor wafer

摘要

A dicing tape comprising a substrate sheet and a pressure-sensitive adhesive layer formed on one surface of the substrate sheet, wherein the substrate sheet comprises an upper layer in direct contact with the pressure-sensitive adhesive layer, an intermediate layer adjacent to the upper layer, and a lower layer adjacent to the intermediate layer, and an anti-extensibility (A) of the upper layer, an anti-extensibility (B) of the intermediate layer, and an anti-extensibility (C) of the lower layer satisfy the equation (I): $the\; anti-extensibility\; being\; a\; product\; of\; a\; modulus\; of\; elasticity\; and\; a\; layer\; thickness,\; is\; disclosed.\; The\; present\; dicing\; tape\; can\; uniformly\; and\; sufficiently\; enlarge\; dicing\; lines\; without\; affect\; by\; a\; modulus\; of\; elasticity\; of\; a\; pressure-sensitive\; adhesive,\; and\; is\; rarely\; broken\; at\; the\; dicing\; lines.\mathop{\mathrm{image}}$