Method and apparatus for providing rotational burn-in stress testing

摘要

A method and device are provided for stress testing a chip. The chip may be partitioned into at least a first block and a second block. Burn-in stress testing may be performed on electronic devices within the first block without simultaneously performing burn-in stress testing on electronic devices within the second block. A burn-in stress testing device may perform the burn-in testing. A control device may be coupled to the burn-in stress testing device to enable burn-in stress testing on electronic devices within at least the first block of the chip without simultaneously enabling burn-in stress testing on the second block of the chip.