发明名称 |
Method for a plan-view transmission electron microscopy sample preparation technique for via and contact characterization |
摘要 |
A method for preparing a transmission electron microscopy (TEM) sample for contact and via characterization. Specifically, one embodiment of the present invention discloses a method where an integrated circuit semiconductor chip (IC chip) is bonded to a piece of glass and attached to a sample holder. Areas of the IC chip are removed by polishing until a region surrounding a particular contact or via is exposed. The piece of glass supports the IC chip during the polishing process. The IC chip is cut using a focused ion beam to create a thin membrane suitable for TEM failure analysis. The thin membrane includes a plan-view cross-section from the particular contact or via. The cross-sectional plan-view is perpendicular to the longitudinal axis of the contact or via.
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申请公布号 |
US6683304(B1) |
申请公布日期 |
2004.01.27 |
申请号 |
US20020192751 |
申请日期 |
2002.07.08 |
申请人 |
CHARTERED SEMICONDUCTOR MANUFACTURING LIMITED |
发明人 |
JIYAN DAI;FOONG TEE SIAM;LAM TAI CHUI;ER EDDIE;REDKAR SHAILESH |
分类号 |
G01N1/28;(IPC1-7):G01N23/00;G21K7/00 |
主分类号 |
G01N1/28 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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