| 摘要 |
PURPOSE: A semiconductor device with a package which is capable of stacking the semiconductor device easily is provided to stack a plurality of semiconductor chips without an additional process by improving a structure of a package body. CONSTITUTION: A semiconductor device having a package for stack includes a package body(100), a semiconductor chip(202), a bonding pad(106), a metal connector(110), and a conductor line(108). The package body(100) has a shape of cup and an upper end including a flat side. The semiconductor chip(202) is installed on a center of the upper end of the package body(100). The bonding pad(106) is installed at a peripheral part of the upper end. The metal connector(110) is installed at a lower end of a side of the package body(100). The conductor line(108) is used for connecting electrically the bonding pad(106) to the metal connector(110). The semiconductor chip(202) and the bonding pad(106) are sealed each other by a sealant.
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