发明名称 METHOD OF MANUFACTURING LDMOS SEMICONDUCTOR DEVICE
摘要 <P>PROBLEM TO BE SOLVED: To uniform a gate oxide film on a boundary near the surface of an NWELL between the NWELL and a DWELL and on a channel region. <P>SOLUTION: The gate oxide film (104a) is formed on the NWELL (102) in advance. Then, on the gate oxide film, a stepped mask (130a) with a level difference in thickness which consists of a thick portion and a thin portion is formed. With the thick portion as a mask, impurity ions for the DWELL (122) are implanted into the NWELL (102). Then, with the whole mask including the thick portion and the thin portion as a mask, impurity ions for source/drain regions are implanted. Thereafter, the dopants are thermally diffused to simultaneously form a DWELL diffusion layer (122), a source diffusion layer (124), and a drain diffusion layer (126). <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004022765(A) 申请公布日期 2004.01.22
申请号 JP20020174950 申请日期 2002.06.14
申请人 OKI ELECTRIC IND CO LTD 发明人 SASAKI KATSUTO
分类号 H01L21/28;H01L21/336;H01L29/423;H01L29/78 主分类号 H01L21/28
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