| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder anchoring structure for strengthening the solder joint and for preventing generation of exfoliation in the interface of a Au-Sn alloy layer and a Sn containing solder layer, conductive patterns including the anchoring structure and further chip parts equipped with the conductive patterns, including the solder anchoring structure, circuit components, substrate parts, electronic parts and electrical components. SOLUTION: There are provided the anchoring structure in which the interface of the Au-Sn alloy and the Sn containing solder layer forms irregular and nonlinear patterns, that comprise a plurality of mounds and troughs of various heights and depths, the conductive patterns including the solder anchoring structure, and further chip parts equipped with the conductive patterns including the solder anchoring structure, circuit components, substrate parts, electronic parts and electrical components. COPYRIGHT: (C)2004,JPO |
