发明名称 INSERT MOLDING CASE AND SEMICONDUCTOR DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To firmly fix a terminal to an insulating case body in an insert molding case. <P>SOLUTION: A terminal 150 is formed of a plate-like member bent to an L-shape and includes a first part 151 and a second part 152 forming each side of the L-shape. The second part 152 is embedded and inserted inside a case body 110 so that a bonding surface 153 is exposed. Projections 111 of the case body 110 are formed on both sides of the second part 512 in the width direction DW of the second part 152, and the projection 111 is in contact with the side 155 of the second part and projects outside the bonding surface 153. A distance L1 between the projections 111 and the width L2 of the second part 152 satisfy an expression of L1≤L2 and L1≈L2. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004022811(A) 申请公布日期 2004.01.22
申请号 JP20020175743 申请日期 2002.06.17
申请人 MITSUBISHI ELECTRIC CORP 发明人 IWAASA TATSUYA;OGURI YOSHIHISA;TSUKAMOTO HIDEKI
分类号 H01L25/07;H01L23/08;H01L25/18;(IPC1-7):H01L23/08 主分类号 H01L25/07
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