发明名称 Verifying proximity of ground vias to signal vias in an integrated circuit
摘要 Techniques are disclosed for verifying the proximity of ground vias to signal vias in an integrated circuit package design. A package designer creates the package design using a package design tool. A proximity verifier verifies that there is a ground via within a predetermined threshold distance of each specified signal via in the package design. The proximity verifier may notify the package designer of any signal vias which are not sufficiently close to ground vias, such as by providing visual indications of such signal vias in a graphical representation of the package design displayed on a display monitor. In response, the package designer may modify the package model to ensure that all signal vias are sufficiently close to ground vias. The proximity verifier may be implemented as a design rule which may be executed automatically and in real-time by the package design tool.
申请公布号 US2004015796(A1) 申请公布日期 2004.01.22
申请号 US20020199668 申请日期 2002.07.19
申请人 FRANK MARK D.;NELSON JERIMY;MOLDAUER PETER SHAW 发明人 FRANK MARK D.;NELSON JERIMY;MOLDAUER PETER SHAW
分类号 G06F17/50;(IPC1-7):G06F17/50;G06F9/45 主分类号 G06F17/50
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