METHOD FOR CLEANING AND DRYING SEMICONDUCTOR SUBSTRATE

摘要

PROBLEM TO BE SOLVED: To efficiently dry a surface of a semiconductor substrate near a holding part by a holder of the semiconductor substrate in short time and to suppress adhesion of particles and occurrence of a watermark. SOLUTION: A method has a process for immersing and treating the semiconductor substrate 14 kept by a first holder 16 in treatment liquid 13 stored in a treatment tank 11 with the first holder 16, a process for drying only the semiconductor substrate 14 treated by leaving the first holder 16 in the treatment tank 11 while it is pulled up from the treatment tank 11, a process for moving the pulled up semiconductor substrate 14 and drying the semiconductor substrate 14 by making a second holder 21 arranged and dried in a drying tank 12 hold the substrate 14 and a process for taking out the dried semiconductor substrate 14 from the drying tank 12 with the second holder 21. The method includes a process for pulling up and moving the first holder 16 immersed in treatment liquid 13 from the treatment tank 11, and arranging the first holder 16 in the drying tank 12 to dry it to set it as a second holder 21. COPYRIGHT: (C)2004,JPO