| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a liquid flow structure, a cooling device and an electronic apparatus equipment, which can be miniaturized and thinned while having high cooling performance, and to provide a manufacturing method of the liquid flow structure and a porous almina. <P>SOLUTION: The evaporator 2 of the cooling device 1 is provided with an evaporating unit 21 for evaporating liquid, a wick 25, consisting of porous alumina and conducting the liquid to flow into the evaporating unit 21 while evaporating the same, and a liquid reservoir 27 for storing the liquid transported from a condenser 3. In this case, the evaporating unit 21 and the liquid reservoir 27 are constituted so as to be connected through the wick 25. <P>COPYRIGHT: (C)2004,JPO |
