| 摘要 |
In a plastic-encapsulated semiconductor package with a lead frame which cooperates with a semiconductor chip (1) and which has tie-bars (3) and electrical connectors, the novelty is that the tie-bars (3) are uniformly peripherally distributed wrt. a major face of the chip (1) and each has an inner end extending separately from the exterior into a chip corner region, without formation of a connected paddle, for bonding to the chip corner region. Preferably, the tie-bar ends are bonded onto the chip (1) by an adhesive layer, a polyimide layer being provided between the chip and the adhesive layer preferably in the form of a lead-on-chip (LOC) tape. Also claimed is a lead frame, as described above, for use in the above package. |
