发明名称 METHOD OF MANUFACTURING ELECTRONIC PART, MOTHER BOARD FOR MANUFACTURING ELECTRONIC PART, ELECTRONIC PART, AND INTERMEDIATE MOLD THEREOF
摘要 PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic part that enables downstream operations such as an inspection without the necessity for cutting off all ceramic bases after plating, in contrast to a method of improving production efficiency by dividing a ceramic base in the manufacturing of an electronic part such as a quartz oscillator. SOLUTION: A plurality of ceramic bases are integrally formed in a ceramic laminate E in a matrix form. Plating is performed on a base metal layer having a wiring pattern and so forth which is formed beforehand on the ceramic laminate E. The ceramic laminate E is split in the column direction of the ceramic bases to have broken laminates F. Quartz resonator plates are mounted on the ceramic bases on the broken laminates F. After frequency adjustment is performed on the quartz oscillator plates, caps are joined to the ceramic bases and the broken laminates F are divided to have quartz oscillators 1. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004022558(A) 申请公布日期 2004.01.22
申请号 JP20020171024 申请日期 2002.06.12
申请人 DAISHINKU CORP 发明人 IIZUKA MINORU
分类号 H05K3/32;H01L23/12;H03H3/02;H03H3/04;H05K1/02;H05K3/00;H05K3/24;H05K3/34;(IPC1-7):H05K3/00 主分类号 H05K3/32
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